Inspecting Integrated Circuits (ICs)


Integrated circuit (IC) production operates at high speeds, and maintaining quality is crucial. Manufacturers require reliable inspection methods that can keep up with line speed. By using a combination of high-resolution cameras paired with frame grabbers for capturing high-speed images, and 3D profile sensors for surface inspection, manufacturers can achieve 100% inspection without compromising productivity for optimized yields. Inspections are powered by Zebra Aurora machine vision software, which helps accelerate application development and rollout. 

Machine Vision Frame Grabber Photography Website IC Packaging Inspection 4x3 3600

Combine track-and-trace, 2D/3D inspection, and image processing to catch IC defects at full production speed and maintain comprehensive end-to-end records

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Accelerate high‑speed image capture

Rapixo frame grabbers support high-speed image capture at high resolution to detect yield-limiting defects in IC components without compromising throughput. Zebra Frame Grabbers support the latest high-bandwidth camera interfaces, including Camera Link, CoaXPress, and CoaXPress-over-Fibre, with generation-to-generation compatibility. Custom image processing algorithms using field-programmable gate arrays (FPGAs) can be ported to new machines, reducing the time and engineering overhead involved in bringing new solutions to market.

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Apply thorough 3D surface and dimension checks

AltiZ 3D profile sensors add calibrated height data revealing minute defects that 2D alone can miss on reflective or low contrast packaging surfaces, such as cracks or molding defects. The AltiZ profile sensor captures precise profiles for coplanarity, standoff, package height, and for determining solder height while maintaining inspection speed.

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Drive process improvements in IC manufacturing with data-driven insights

Aurora Imaging Library elevates IC inspections by offering a comprehensive suite of high-speed, high-accuracy vision tools offering code-level customization for automated optical inspection (AOI) applications. These tools facilitate key tasks across multiple stages of IC manufacturing, including locating and orienting ICs using advanced geometric tools, detecting surface defects with image processing and edge detection, and verifying markings through OCR and code reading. The library also provides precise 2D and 3D measurement capabilities, ensuring compliance with strict manufacturing tolerances. 

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