MC55E0 AND MC55E0-HC Operating System
Unrestricted
Unrestricted
With Login
Demoware
Restricted
Subscription
- Operating System for Windows Embedded Handheld 6.5
Installation Requirements
Please refer to the release notes.
Versions
BSP 02.57.00
+
Update 02 - Localized
Release Date:
December 2018
Update 02 - Localized
Release Date:
December 2018
Device Compatibility
This software has been approved for use with the following devices:- - MC55X
- - MC55X-HC
Documentation
Software
CFE package without auto Warm boot - Japanese
CFE package without auto Warm boot - Japanese
+
Update 01 - Localized
Release Date:
December 2018
Update 01 - Localized
Release Date:
December 2018
Device Compatibility
This software has been approved for use with the following devices:- - MC55X
- - MC55X-HC
Documentation
Software
CFE package without auto Warm boot - Simplified Chinese
CFE package with auto Warm boot - Simplified Chinese
CFE package without auto Warm boot - Chinese Traditional
CFE package with auto Warm boot - Chinese Traditional
CFE package without auto Warm boot - Japanese (released in May 2018)
CFE package with auto Warm boot - Japanese (released in May 2018)
CFE package without auto Warm boot - Korean
CFE package with auto Warm boot - Korean
+
Update 03
Release Date:
September 2018
Update 03
Release Date:
September 2018
Device Compatibility
This software has been approved for use with the following devices:- - MC55X
- - MC55X-HC
Documentation
Software
CFE package without auto Warm boot
CFE package with auto Warm boot
+
Update 02
Release Date:
July 2018
Update 02
Release Date:
July 2018
Device Compatibility
This software has been approved for use with the following devices:- - MC55X
- - MC55X-HC
Documentation
Software
CFE package without auto Warm boot
CFE package with auto Warm boot
+
Update SPR 34400 Enhanced USB Driver for KVL4000
Release Date:
June 2018
Update SPR 34400 Enhanced USB Driver for KVL4000
Release Date:
June 2018
Device Compatibility
This software has been approved for use with the following devices:- - MC55X-HC
Documentation
Software
Hotfix package without auto warm boot
Hotfix package with auto warm boot
+
Update 01
Release Date:
June 2018
Update 01
Release Date:
June 2018
Device Compatibility
This software has been approved for use with the following devices:- - MC55X
- - MC55X-HC
Documentation
Software
CFE package without auto Warm boot
CFE package with auto Warm boot
+
Full Image - Localized
Release Date:
February 2018
Full Image - Localized
Release Date:
February 2018
Device Compatibility
This software has been approved for use with the following devices:- - MC55X
- - MC55X-HC
Documentation
Software
AirBeam Package for OS update (without clean application) - Simplified Chinese
AirBeam Package for OS update (with Clean Application) - Simplified Chinese
OS update package (with Clean Application) - Simplified Chinese
OS update package (without clean application) - Simplified Chinese
AirBeam Package for OS update (without clean application) - Traditional Chinese
AirBeam Package for OS update (with Clean Application) - Traditional Chinese
OS update package (with Clean Application) - Traditional Chinese
OS update package (without clean application) - Traditional Chinese
AirBeam Package for OS update (without clean application) German
AirBeam Package for OS update (with Clean Application) German
OS update package (with Clean Application) German
OS update package (without clean application) German
AirBeam Package for OS update (without clean application) French
AirBeam Package for OS update (with Clean Application) French
OS update package (with Clean Application) French
OS update package (without clean application) French
AirBeam Package for OS update (without clean application) Italian
AirBeam Package for OS update (with Clean Application) Italian
OS update package (with Clean Application) Italian
OS update package (without clean application) Italian
AirBeam Package for OS update (without clean application) - Japanese
AirBeam Package for OS update (with clean application) - Japanese
OS update package (with clean application) - Japanese
OS update package (without clean application) - Japanese
AirBeam Package for OS update (without clean application) - Korean
AirBeam Package for OS update (with Clean Application) - Korean
OS update package (with Clean Application) - Korean
OS update package (without clean application) - Korean
AirBeam Package for OS update (without clean application) Spanish
AirBeam Package for OS update (with Clean Application) Spanish
OS update package (with Clean Application) Spanish
OS update package (without clean application) Spanish
+
Full Image
Release Date:
January 2018
Full Image
Release Date:
January 2018
Device Compatibility
This software has been approved for use with the following devices:- - MC55X
- - MC55X-HC
Documentation
Software
AirBeam Package for OS update (without clean application)
AirBeam Package for OS update (with Clean Application)
OS update package (with Clean Application)
OS update package (without clean application)
BSP 01.57.04
+
Full Image
Release Date:
December 2017
Full Image
Release Date:
December 2017
Device Compatibility
This software has been approved for use with the following devices:- - MC55X
- - MC55X-HC
Documentation
Software
Package file for OS update/clean application package using AirBeam.
OS update package
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